The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Awards
Awards
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The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology |
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Department of Mechanical and Aerospace Enginering, The Ohio state University, 2012 |
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American Society of Mechancial Engineers Electronic and Photonic Packaging Division, 2012 |
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Sigma Xi, Georgia Institute of Technology, 2008 |
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Embedded Passives in Organic Structures:IEEE Transactions on Components and Packaging Technologies, March 2007. Lee, K. J., Damani, M., Pucha, R., Bhattacharya, S., Tummala, R., and Sitaraman, S. K., "Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 1, 2007, pp. 152-162. |
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Georgia Institute of Technology, 2006 |
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Suresh K. Sitaraman, Ph.D., 2004 |
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IEEE Transactions on Advanced Packaging, “The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade,” R. R. Tummala, M. Swaminathan, M. M. Tentzeris, J. Laskar, G. K. Chung, S. Sitaraman, et al., May 2004 |
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Selected by the Board of Engineering Education, ASME, Fall 2003-Present. |
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May 2003. Zhu, Q., Ma, L., and Sitaraman, S. K., “Design Optimization of One-Turn Helix - a Novel Compliant Off-Chip Interconnect,” IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, May 2003, pp. 106-112. |
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"Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package," V. Sundararaman and S. K. Sitaraman |
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International Symposium and Exhibition on Advanced Packaging Materials, IMAPS, March 2000, “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” by Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M. |
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"Development of Virtual Reliability Methodology for Area-Array Devices used in Implantable and Automotive Applications," S. Sitaraman, R. Raghunathan, and C. E. Hanna, 2000 |
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5th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS, March 1999, “Multi-Layered Structure: Adhesive Selection and Process Mechanics,” Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T. |
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Suresh K. Sitaraman, Ph.D., 1999. Please see http://www.whistle.gatech.edu/archives/99/march/1 |
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NSF Packaging Research Center – 1998 |
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Suresh K. Sitaraman, Ph.D., 1997-2002 |
Student Awards and Honors
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Surface Mount Technologies Association (SMTA) Hutchins Grant, 2014
Christine Taylor |
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First Place, Student Poster Competition, Glass Interposer Technology 2013 Workshop
Scott McCann November 2013, Atlanta, Georgia; for the poster titled, “Fabrication Process and Modeling of Glass Interposers for Warpage Study,” by Scott McCann and Suresh K. Sitaraman |
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Intel Best Student Paper at 62nd ECTC
Sathyanarayanan Raghavan Interlayer Dielectric Cracking in Back End of Line (BEOL) Stack by Sathyanarayanan Raghavan – Georgia Institute of Technology; Ilko Schmadlak – Freescale Semiconductor; and Suresh K. Sitaraman |
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First Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop
Raphael Okereke November 2012, Atlanta, Georgia; for the poster titled, “Mechanically Compliant Single-Path and Multi-Path Electrical Interconnects,” by Okereke, Bhat, Lee, Kacker, Lo, Xu, Zhu, and Suresh K. Sitaraman |
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Third Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop
Xi Liu and Christine Taylor November 2012, Atlanta, Georgia; for the poster titled, “Three-Dimensional Stacked Dies with Through Silicon Vias: In-situ Stress Characterization and Thermo-Mechanical Reliability Assessment,” by Xi Liu, Christine Taylor, and Suresh K. Sitaraman |
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Sigma Xi, Best Doctoral Thesis Award, 2012
Gregory Ostrowicki |
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First Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME IMECE2010
Raphael Okereke ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Parallel-Path Compliant Structures as Electrical Interconnects,” by Raphael Okereke, Karan Kacker, and Suresh K. Sitaraman |
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Second Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME 2010 IMECE2010
Gregory Ostrowicki ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Magnetically Actuated Peel Test for Interfacial Fracture and Fatigue Characterization,” by Greg Ostrowicki and Suresh K. Sitaraman. |
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Sam Nunn Security Program Fellow
Kevin Klein, Georgia Institute of Technology, 2006 |
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Atlanta Surface Mount Technology Association (SMTA) Scholarship winner
Andrew Perkins, 2005 |
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Atlanta Surface Mount Technology Association (SMTA) Scholarship winner
Shashi Hegde, 2005 |
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Sigma Xi, Best Doctoral Thesis Award, 2004
Qi Zhu, 2004 |
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SMTA Hutchins Grant
Andrew Perkins, 2003 |
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First Place, Student Poster Competition, PRC/NSF, Fall 2003
George Lo, Qi Zhu, et al. ‘Compliant Interconnects,’ PRC/NSF, Fall 2003 |
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Third Place, Student Poster Competition, PRC/NSF, Fall 2003
S. Hegde, et a. ‘Optoelectronic Reliability,’ , PRC/NSF, Fall 2003 |
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IMAPS Educational Foundation Scholarship
James Pyland, 2000-2001 |
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Presidential Fellowship
A. Perkins, Fall 2000 - 2004 |
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IMAPS Educational Foundation Scholarship
Joe Haemer, 1999-2000 |
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Presidential Fellowship
M. Modi, Fall 1999-2003 |
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Onassis Foundation Scholarship
S. Michaelides, 1997-1999 |
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Outstanding Poster Award (Graduate/ART) - Second Place - IAB/NSF Site Visit
R. Dunne |
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Outstanding Poster Award (Undergraduate) - First Place - IAB/NSF Site Visit
C. Johnson O Thermo-Mechanical Reliability of Vias - IAB/NSF Site Visit, Oct. 1997 |
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Sigma Xi Undergraduate Research Award
Jill Conley “Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test.” 1996 |
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Leventis Foundation Scholarship
S. Michaelides PhD Student, 1995-1997 |