Trench-via Shape Design of On-Chip Interconnect with Cu/Low-K Patent
Submitted by Caspar_admin on Fri, 07/12/2013 - 21:36Provisional Patent, “Trench-via Shape Design of On-Chip Interconnect with Cu/Low-K,” J. Zheng, R. Pucha, and S. K. Sitaraman, Filed in July 2004, Based on Invention Disclosure GTRC ID 3219.
type:
Provisional Patent
Year:
2 004