Variable Interconnect Geometry with Optimal Electrical and Mechanical Properties for Electronic Packages Patent
Submitted by Caspar_admin on Fri, 07/12/2013 - 21:41Provisional Patent, K. Kacker and S. K. Sitaraman, “Variable Interconnect Geometry with Optimal Electrical and Mechanical Properties for Electronic Packages,” May 2006, Based on Invention Disclosure GTRC ID#3883.
type:
Provisional Patent
Year:
2 006