IMAPS Best Paper of the Session
Submitted by Caspar_admin on Fri, 07/12/2013 - 23:135th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS, March 1999, “Multi-Layered Structure: Adhesive Selection and Process Mechanics,” Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T.
type:
Award
Year:
1 999