IMAPS Best Paper of the Session
Submitted by Caspar_admin on Fri, 07/12/2013 - 23:15International Symposium and Exhibition on Advanced Packaging Materials, IMAPS, March 2000, “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” by Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M.
type:
Award
Year:
2 000