Cover Image, IEEE Transactions on Components and Packaging Technologies

Submitted by Caspar_admin on Fri, 07/12/2013 - 23:25

Embedded Passives in Organic Structures:IEEE Transactions on Components and Packaging Technologies, March 2007. Lee, K. J., Damani, M., Pucha, R., Bhattacharya, S., Tummala, R., and Sitaraman, S. K., "Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 1, 2007, pp. 152-162.

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Award
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2 007