Mechanically Compliant I/O Interconnects and Packaging
Submitted by Caspar_admin on Mon, 11/04/2013 - 18:06Citation:
Sitaraman, S. K. and Kacker, K., “Mechanically Compliant I/O Interconnects and Packaging,” Chapter 3, Integrated Interconnect Technologies for 3D Nanoelectronic Systems, Ed. Muhannad S. Bakir and James D. Meindl, Artech House, 2009.