Domed and Released Thin Film Construct – An Approach for Material Characterization and Compliant Interconnects
Submitted by Caspar_admin on Mon, 11/04/2013 - 18:28Citation:
Ostrowicki, G. T., Fritz, N. T., Okereke, R. I., Kohl, P. A., and Sitaraman, S. K., “Domed and Released Thin Film Construct – An Approach for Material Characterization and Compliant Interconnects,” IEEE Transactions on Device and Materials Reliability,” Vol. 12, No. 1, March 2012, pp. 15-23.