Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods
Submitted by Caspar_admin on Mon, 11/04/2013 - 19:24Kacker, K. and Sitaraman, S. K., “Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods,” U. S. Patent No. 8,382,489 B2, Feb. 26, 2013.
type:
US Patent
Year:
2 013