Design and Fabrication of β-fly: a Chip-to-Substrate Interconnect
Submitted by Caspar_admin on Mon, 11/25/2013 - 18:20Citation:
Zhu, Q., Ma, L., and Sitaraman, S. K., “Design and Fabrication of β-fly: a Chip-to-Substrate Interconnect,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, September 2003, pp. 582-590.