Study of Coupled Thermal Electric Behavior of Compliant Micro-Spring Interconnects For Next Generation Probing Applications
Submitted by Caspar_admin on Mon, 11/25/2013 - 18:21Citation:
Ahmad, M. and Sitaraman, S. K., “Study of Coupled Thermal Electric Behavior of Compliant Micro-Spring Interconnects For Next Generation Probing Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 2, June 2003, pp. 407-415.