Study of Mechanical Behavior of Compliant Micro-Springs for Next-Generation Probing Applications
Submitted by Caspar_admin on Mon, 11/25/2013 - 18:25Citation:
Ahmad, M. and Sitaraman, S. K., “Study of Mechanical Behavior of Compliant Micro-Springs for Next-Generation Probing Applications,” Transactions of the ASME - Journal of Electronic Packaging Vol. 124, December 2002, pp. 411-418.