Die Cracking and Reliable Die Design for Flip-Chip Assemblies
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:23Citation:
Michaelides, S. and Sitaraman, S. K., “Die Cracking and Reliable Die Design for Flip-Chip Assemblies,” IEEE Transactions on Advanced Packaging, IEEE-Components, Packaging, and Manufacturing Technology Society, Vol. 22, No. 4, November 1999, pp. 602-613.