Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:40Citation:
Modi, M.B and Sitaraman, S.K.(2002). Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, LA, IMECE2002/EPP-39670.