A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:41Citation:
Zhu, Q., Ma, L and Sitaraman, S.K (2002). A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect. Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, LA, IMECE2002/EPP-39679.