Thermomechanical Reliability of High Density Wiring Substrates
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:44Citation:
Hegde, S., Pucha, R. V., Takahashi, A., and Sitaraman, S. K., "Thermomechanical Reliability of High Density Wiring Substrates," ITHERM’2002, The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE-CPMT, ASME, and IMAPS, pp. 919-925.