Determining Interfacial Delamination Propagation of ViaLuxTM 81/Copper Interface in Multilayered SOP Integrated Substrates
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:47Citation:
Xie, W., Hu, H., and Sitaraman, S. K., “Determining Interfacial Delamination Propagation of ViaLuxTM 81/Copper Interface in Multilayered SOP Integrated Substrates,” InterPACK, July 2001, IPACK2001-15603.