Compliant Cantilevered Spring Interconnects for Flip-Chip Packaging
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:50Citation:
Ma, L., Zhu, Q., Modi, M., Sitaraman, S. K., Chua, C., and Fork, D., “Compliant Cantilevered Spring Interconnects for Flip-Chip Packaging,” InterPACK, July 2001, IPACK2001-15695.