Numerical Study of Interfacial Delamination in a System-on-Package (SOP) Integrated Substrate Under Thermal Loading

Submitted by Caspar_admin on Fri, 01/03/2014 - 20:55
Citation: 
Xie, W. and Sitaraman, S. K., "Numerical Study of Interfacial Delamination in a System-on-Package (SOP) Integrated Substrate Under Thermal Loading" ITHERM’2000, The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. II, IEEE-CPMT, ASME, IMAPS, and NIST, May 2000, pp. 356-361.