Process Modeling and Interfacial Behavior in the VSPA Package
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:04Citation:
Harries, R. and Sitaraman, S. K., “Process Modeling and Interfacial Behavior in the VSPA Package,” MD-Vol. 80, Composites and Functionally Graded Materials, ASME 1997, pp. 293-299.