Thermal Fatigue Life of the VSPA Package Solder Joints

Submitted by Caspar_admin on Fri, 01/03/2014 - 21:10

Citation:

Murphy, R. S. and Sitaraman, S. K., “Thermal Fatigue Life of the VSPA Package Solder Joints”, 8th Symposium on Mechanics of Surface Mount Assemblies, 96-WA/EEP-13, ASME International Mechanical Engineering Congress, Atlanta, Nov. 1996.