Use of Compliant Interconnects for Drop Impact Isolation
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:15Citation:
Chen, W., Bhat, A., and Sitaraman, S. K., “Use of Compliant Interconnects for Drop Impact Isolation,” 63rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 835-839