Three-Path Electroplated Copper Compliant Interconnects: Fabrication and Modeling Studies
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:16Citation:
Okereke, R. and Sitaraman, S. K., “Three-Path Electroplated Copper Compliant Interconnects: Fabrication and Modeling Studies,” 63rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 129-135.