System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:26Citation:
Kim, I., Pucha, R. V., Peak, R. S., and Sitaraman, S. K., “System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems,” 57th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Reno, NV, May 2007, pp. 1809-1814.