In-Process Measurement of the Interfacial Fracture Toughness for a Sub-micron Titanium Thin Film and Silicon Interface using a Single-Strip Decohesion Test

Submitted by Caspar_admin on Fri, 01/03/2014 - 21:37
Citation: 
Zheng, J. and Sitaraman, S. K., "In-Process Measurement of the Interfacial Fracture Toughness for a Sub-micron Titanium Thin Film and Silicon Interface using a Single-Strip Decohesion Test," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 134-139.