Novel Board Material Technology for Next-Generation Microelectronic Packaging
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:38Citation:
N. Kumbhat, P. Markondeya Raj, S. Hegde, R.V. Pucha, V. Sundaram, S. Hayes, S. Atmur, S. Bhattacharya, S.K. Sitaraman, and R.R. Tummala, "Novel Board Material Technology for Next-Generation Microelectronic Packaging" in Developments in Dielectric Materials and Electronic Devices, Ceramic Transactions (K.M.Nair et al, Editors), Vol.167, 2004, pp. 371-382.