Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:40Citation:
Perkins, A., and Sitaraman, S.K. “Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages,” 53nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 422-430.