High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined spring arrays
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:52Citation:
Chua, C. L., Fork, D. K., Smith, D. L., McIntyre, H., Ma, L., Zhu, Q., Modi, M. and Sitaraman, S. K., “High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined spring arrays”, Proceedings of IEEE Lasers and Electro-Optics Society (LEOS) 2000 Annual Meeting, Rio Grande, Puerto Rico, November 2000.