Thermally-Induced Warpage and Stresses in Flip-Chip on Board (FCOB) Assembly
Submitted by Caspar_admin on Fri, 01/03/2014 - 22:03Citation:
Pang, H. L. J., Sitaraman, S. K., Zwemer, D. A., and Hassell, P., “Thermally-Induced Warpage and Stresses in Flip-Chip on Board (FCOB) Assembly”, 2nd International Advanced Technology Workshop on Flip Chip Technology, IMAPS-IEEE, March 14-16, 1998, Braselton, GA.