Two and Three-Dimensional Modeling of VSPA Butt Solder Joints

Submitted by Caspar_admin on Fri, 01/03/2014 - 22:05

Citation:

Murphy, R. S. and Sitaraman, S. K., “Two and Three-Dimensional Modeling of VSPA Butt Solder Joints”, 47th Electronic Components and Technology Conference, IEEE and EIA , San Jose, CA, May 18-21, 1997, pp. 472-478.