Microelectronic Package Trends - The Role of Reliability in Particular, Related to Solder Joints

Submitted by Caspar_admin on Fri, 01/03/2014 - 22:06
Citation: 
Wong, C. P., Tummala, R., Qu, J., and Sitaraman, S., “Microelectronic Package Trends - The Role of Reliability in Particular, Related to Solder Joints,” Design and Reliability of Solder and Solder Interconnections, Ed. R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw, and W. L. Winterbottom, The Minerals, Metals, and Materials Society, Orlando, FL, Feb. 1997, pp. 3-8 (invited).