A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens under Mixed Mode I/III Loading

Submitted by Caspar_admin on Mon, 06/25/2018 - 09:57

Citation:

Rambhatla, V.T., Samet, D., McCann, S.R. and Sitaraman, S.K., “A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens under Mixed Mode I/III Loading” 67th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Lake Buena Vista, FL, May 2017, pp. 1888-1893.