Visualization of Delamination in Encapsulated Flexible Electronics Fabricated using Slot Die Coating
Submitted by Caspar_admin on Thu, 12/03/2020 - 16:55Citation:
Jeong, T. J., Prasath, R. G. R., Sitaraman, S. K., and Harris, T. A. L., “Visualization of Delamination in Encapsulated Flexible Electronics Fabricated using Slot Die Coating,” Journal of Electronic Materials, pp. 1-8, 2020.