Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination
Submitted by Caspar_admin on Thu, 12/03/2020 - 16:55Citation:
Kwatra, A., Samet, D., Rambhatla, V. N. N. T., and Sitaraman, S. K., “Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination,” Microelectronics Reliability 111, p. 113647, 2020