Nanopackaging: Nanotechnologies and Electronics Packaging,
Submitted by Caspar_admin on Thu, 12/03/2020 - 17:17Citation:
Ma, L., Sitaraman, S. K., Zhu, Q., Klein, K., and Fork, D., “Design and Development of Stress-Engineered Compliant Interconnect in Microelectronic Packaging,” Chapter 28, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition, Ed. James E. Morris, Springer, 2018.