Undergraduate Students
Undergraduate Alumni
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![]() Thermo-Mechanical Modeling and Experiments for Microelectronic Packaging Reliability 2000 |
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![]() Mechanical Characterization of Electroplated Copper Micro-scale Thin Films 2013 |
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![]() Study of Inter-facial Delamination in Copper/Epoxy Mold Compound interface 2014 |
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